Product Overview
The Heat Sink Compound - Grey Ultra Max™ in its 10g syringe format offers exceptional thermal management for high-performance applications. Its advanced high-density formula, infused with heat-conductive metal oxide, ensures outstanding thermal conductivity and superior stability in extreme conditions. This non-curing, flowable thermal paste is electrically insulating, making it safe for use in sensitive environments, and performs reliably across a wide temperature range from -40°C to 150°C, withstanding peaks up to 200°C. Conveniently packaged in a 5cc syringe, it is easy to apply and perfect for professional or industrial use. Fully compliant with RoHS 3 and REACH standards, this compound guarantees over 8 years of dependable performance, making it a trusted choice for demanding thermal management solutions.
- Professional-grade thermal paste designed for high-performance heat dissipation
- Ultra Max™ high-density formulation ensures superior thermal conductivity and high-temperature stability
- Non-curing and flowable design for easy application and reliable performance
- Electrically insulating for added safety in sensitive electronic environments
- Durable 10g syringe format provides ample material for multiple applications
- Compliant with RoHS 3 and REACH standards, meeting global safety and environmental guidelines
- Long shelf life and operating reliability exceeding 8 years under optimal conditions
Product details
| Dispensing Method |
Syringe |
| Weight |
10g |
| SVHC |
No SVHC (21-Jan-2025) |
| Volume |
- |
| Product Range |
- |
Other details
| Brand |
CHIP QUIK |
| Part Number |
TC3-10G |
| Quantity |
Each |
| Technical Data Sheet (259.72KB) EN |
View or download |
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