Product Overview
A lower density flux vehicle for better shear spread and improved flow during heating.
- Ideal for all rework, solder, de-solder and reflow applications
- Non-corrosive, non-conductive, no-clean
- Tack flux will not run all over PCB when applied
- Excellent wetting
- Easily cleaned with isopropyl alcohol (IPA)
- Attachment of BGA spheres
- Soldering flip chip components
- Long stencil life, Wide process window
- Halogen Free (EN14582 test method)
- Clear residue
- Can be used with leaded and lead-free applications
- Volume: 30cc
Product details
| Flux Type |
No Clean |
| Dispensing Method |
Syringe |
| Weight |
30g |
| SVHC |
No SVHC (21-Jan-2025) |
| Flux Applications |
Soldering |
| Volume |
30cc |
| Product Range |
NC191 Series |
Other details
| Brand |
CHIP QUIK |
| Part Number |
NC191-30CC |
| Quantity |
Each |
| Technical Data Sheet (50.00B) EN |
View or download |
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