Product Overview
Heat curing epoxy adhesive designed to bond surface mount chips and ICs to printed circuit boards (PCBs).
- Low viscosity
- Designed to be dot/line dispensed
- Allows large/heavy surface mount components to be permanently bonded to a PCB during reflow
- Allows two-sided surface mount reflow without larger chips/ICs coming loose
- Volume: 10cc
Product details
| Adhesive Type |
Epoxy |
| Cure |
Heat |
| Dispensing Method |
Syringe |
| Weight |
10g |
| SVHC |
No SVHC (21-Jan-2025) |
| Adhesive Colour |
0 |
| Tensile Strength |
- |
| Volume |
10cc |
| Product Range |
AD7 Series |
Other details
| Brand |
CHIP QUIK |
| Part Number |
AD7-10S |
| Quantity |
Each |
| Technical Data Sheet (47.00B) EN |
View or download |
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