MT47H128M8SH-25E IT:M is a DDR2 SDRAM. It uses a double data rate architecture to achieve high-speed operation. The double data rate architecture is essentially a 4n-prefetch architecture, with an interface designed to transfer two data words per clock cycle at the I/O balls. A single READ or WRITE operation for the DDR2 SDRAM effectively consists of a single 4n-bitwide, two-clock-cycle data transfer at the internal DRAM core and four corresponding n-bit-wide, one-half-clock-cycle data transfers at the I/O balls. A bidirectional data strobe (DQS, DQS#) is transmitted externally, along with data, for use in data capture at the receiver. DQS is a strobe transmitted by the DDR2 SDRAM during READs and by the memory controller during WRITEs. DQS is edge-aligned with data for READs and centre-aligned with data for WRITEs. The x16 offering has two data strobes, one for the lower byte (LDQS, LDQS#) and one for the upper byte (UDQS, UDQS#).
- 128M8 configuration, tCK = 2.5ns, CL = 5 cycle time
- JEDEC-standard 1.8V I/O (SSTL
- 18-compatible), differential data strobe (DQS, DQS#) option
- Programmable CAS latency (CL), posted CAS additive latency (AL)
- Selectable burst lengths (BL): 4 or 8, adjustable data-output drive strength
- DLL to align DQ and DQS transitions with CK, 8 internal banks for concurrent operation
- Industrial temperature range from -40°C to +85°C
- Package style is 60-ball FBGA
Product details
DRAM Type:
DDR2
|
Memory Density:
1Gbit
|
Memory Configuration:
128M x 8bit
|
Clock Frequency Max:
400MHz
|
IC Case / Package:
TFBGA
|
No. of Pins:
60Pins
|
Supply Voltage Nom:
1.8V
|
IC Mounting:
Surface Mount
|
Operating Temperature Min:
-40°C
|
Operating Temperature Max:
95°C
|
Product Range:
-
|
MSL:
MSL 3 - 168 hours
|
Other details
Brand |
MICRON |
Part Number |
MT47H128M8SH-25E IT:M |
Quantity |
Each |
Technical Data Sheet EN |
|
All product and company names are trademarks™ or registered® trademarks of their respective holders. Use of them does not imply any affiliation with or endorsement by them.