IM70A135V01XTMA1 is a high performance analogue XENSIV� MEMS microphone. It is a compact size and high-performance microphone with a very high acoustic overload point of 135 dBSPL. This microphone is based on Infineon's new Sealed Dual Membrane MEMS technology which delivers high ingress protection (IP57) at a microphone level. The small size makes this microphone especially suited for TWS earbud applications. Potential applications includes active noise cancellation (ANC) headphones and wireless earbuds (TWS), devices with voice user interface (VUI), smart speakers, home automation, IoT devices, high quality audio capturing, conference systems, cameras and camcorders, industrial or home monitoring with audio pattern detection.
- Ultra-low 170µA current consumption in high performance mode
- Low current consumption 70µA in low power mode
- Signal-to-noise ratio of 70dB(A) SNR
- Acoustic overload point at 135dBSPL
- Flat frequency response with a low-frequency roll-off at 37Hz
- 10ms typical start-up time (VDD = 2.75V, TA = 25°C, 55% R.H.)
- Supply voltage range from 2.3 to 3V (normal mode)
- Supply voltage range from 1.52 to 1.8V (low power mode)
- 1.2V typical brown out voltage (VDD = 2.75V, TA = 25°C, 55% R.H.)
- PG-TLGA-5-5 package, operating temperature range from -40 to 85°C
Product details
| Audio Control Type:
MEMS Microphone
|
| Supply Voltage Range:
2.3V to 3V
|
| Control Interface:
-
|
| Audio IC Case Style:
TLGA
|
| No. of Pins:
5Pins
|
| Operating Temperature Min:
-40°C
|
| Operating Temperature Max:
85°C
|
| Product Range:
-
|
| Automotive Qualification Standard:
-
|
Other details
| Brand |
INFINEON |
| Part Number |
IM70A135V01XTMA1 |
| Quantity |
Each (Supplied on Cut Tape) |
| Technical Data Sheet EN |
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