CHO-BOND® 1030 conductive adhesive is a one component silver-plated copper filled silicone ideal for thin bond lines and bonding silicone EMI gaskets to metal substrates. CHO-BOND® 1030 is a light grey-colours silicone paste that is predominantly used for bonding elastomer gaskets.
- One-component system so no mixing or measuring required
- Silver-plated copper filler is a low cost solution to electrical bonding
- Good conductivity levels (0.050ohm-cm)
- Moderate adhesion properties (>200 PSI lap shear strength)
- Medium paste consistency means it can be used on overhead or vertical surfaces
- No volatile organic compounds and no corrosive by-products generated when curing
Other details
| Brand |
CHOMERICS |
| Part Number |
50-02-1030-0000-55E |
| Quantity |
Each |
| Technical Data Sheet EN |
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