Gap Pad provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present.
- Eliminates air gaps to reduce thermal resistance
- Highly conformable to reduce interfacial resisitance
- Low-stress vibration dampening
- Compatible with automated dispensing equipment
- Adhesive backed
- Supplied in a 100 x 100mm sheet
Product details
| Thermal Conductivity:
0.8W/m.K
|
| Conductive Material:
-
|
| Thickness:
4.1mm
|
| Thermal Impedance:
-
|
| Dielectric Strength:
-
|
| External Length:
-
|
| External Width:
100mm
|
| Product Range:
-
|
Other details
| Brand |
BERGQUIST |
| Part Number |
D-FAR-0045 |
| Quantity |
Each |
| Technical Data Sheet EN |
 |
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