The ICK BGA 27 X 27 X 10 is a Heat Sink made of aluminium with black anodised finish. It is suitable for use with universal processors IC design BGA. It offers thermal conductive foil and thermal conductive adhesive way of fixation.
- Universal socket
- 3.3W Dissipation loss (Pv)
Applications
HVAC, Thermal Management
Product details
| Thermal Resistance |
18.5°C/W |
| Packages Cooled |
BGA |
| External Width - Metric |
27mm |
| External Height - Metric |
10mm |
| External Length - Metric |
27mm |
| External Diameter - Metric |
- |
| Heat Sink Material |
Aluminium |
| External Width - Imperial |
1.06" |
| External Height - Imperial |
0.39" |
| External Length - Imperial |
1.06" |
| External Diameter - Imperial |
- |
| Product Range |
- |
Other details
| Brand |
FISCHER ELEKTRONIK |
| Part Number |
ICK BGA 27 X 27 X 10 |
| Quantity |
Each |
| Technical Data Sheet EN |
 |
| Drawing EN |
|
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