Product Overview
FEMC512GBE-E540 is an AXO series industrial eMMC 5.1 flash memory. It is fully comply with JEDEC eMMC5.1 Standard. It is combined with an embedded flash controller and standard 3D TLC NAND flash memory in one JEDEC standard package. It provides high performance, good reliability, and advanced power management. It is suitable for small, low-power electronic devices.
- 512GB capacity, VCCQ: 1.8V/3.3V, VCC: 3.3V power system
- Compliant with eMMC specification Ver. 5.1
- High-speed eMMC protocol, clock frequency range from 0 to 200MHz
- Supports three data bus widths: 1 bit (default), 4bits, 8bits
- Supports high speed mode HS400, supports production state awareness
- Supports field firmware update
- Supply voltage (NAND) range from 2.7 to 3.6V, 1.125V/ns min slew rate (with respect to VIH/VIL)
- Clock rise time is 3ns max (CL ≤30pF), clock fall time is 3ns max (CL ≤30pF)
- Output delay time during data transfer is 13.7ns max (CL ≤30 pF)
- 153-ball FBGA package, operation temperature range from -40°C to 85°C
Product details
| Flash Memory Type |
3D TLC NAND |
| Memory Configuration |
512G x 8bit |
| IC Case / Package |
FBGA |
| Clock Frequency Max |
200MHz |
| Supply Voltage Min |
2.7V |
| Supply Voltage Nom |
3.3V |
| Operating Temperature Min |
-40°C |
| Product Range |
3.3V eMMC NAND Flash Memories |
| Memory Density |
512GB |
| Interfaces |
eMMC 5.1 |
| No. of Pins |
153Pins |
| Access Time |
- |
| Supply Voltage Max |
3.6V |
| IC Mounting |
Surface Mount |
| Operating Temperature Max |
85°C |
| SVHC |
To Be Advised |
Other details
| Brand |
FLEXXON |
| Part Number |
FEMC512GBE-E540 |
| Quantity |
Each |
| Technical Data Sheet (1.52MB) EN |
View or download |
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