- High density thermal paste
- White, non-curing and non-flowing thermally conductive heat sink compound
- Heavily filled with heat-conductive metal oxide
- Provides high thermal conductivity, low bleed and high temperature stability
- Electrically insulating (2x 1015 ohm-cm)
Product details
| Dispensing Method |
Syringe |
| Volume |
- |
| Weight |
10g |
| Product Range |
- |
Other details
| Brand |
CHIP QUIK |
| Part Number |
TC1-10G |
| Quantity |
Each |
| Technical Data Sheet EN |
 |
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